Discrete Three-Dimensional Memory Comprising Off-Die Address/Data Translator

ABSTRACT

The present invention discloses a discrete three-dimensional memory (3D-M). Its 3D-M arrays are located on at least one 3D-array die, while its address/data translator (A/D-translator) is located on a separate peripheral-circuit die. The A/D-translator converts at least an address and/or data between logical space and physical spaces for the 3D-array die. A single A/D-translator die can support multiple 3D-array dies.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a continue of application “Discrete Three-Dimensional MemoryComprising Off-Die Address/Data Translator”, application Ser. No.13/787,796, filed Mar. 6, 2013, which is a continuation-in-part ofapplication “Discrete Three-Dimensional Memory”, application Ser. No.13/591,257, filed Aug. 22, 2012, which claims benefit of a provisionalapplication “Three-Dimensional Memory with Separate Memory—Array andPeripheral—Circuit Substrates”, Application Ser. No. 61/529,929, filedSep. 1, 2011.

BACKGROUND

1. Technical Field of the Invention

The present invention relates to the field of integrated circuit, andmore particularly to three-dimensional memory (3D-M).

2. Prior Arts

Three-dimensional memory (3D-M) is a monolithic semiconductor memorycomprising a plurality of vertically stacked memory cells. It includesthree-dimensional read-only memory (3D-ROM) and three-dimensionalrandom-access memory (3D-RAM). The 3D-ROM can be further categorizedinto three-dimensional mask-programmed read-only memory (3D-MPROM) andthree-dimensional electrically-programmable read-only memory (3D-EPROM).3D-M may further comprise at least one of a memristor, a resistiverandom-access memory (RRAM or ReRAM), a phase-change memory, aprogrammable metallization cell (PMC), or a conductive-bridgingrandom-access memory (CBRAM).

U.S. Pat. No. 5,835,396 issued to Zhang on Nov. 3, 1998 discloses a3D-M, more particularly a 3D-ROM. As illustrated in FIG. 1A, a 3D-M die20 comprises a substrate level 0K and a plurality of vertically stackedmemory levels 16A, 16B. The substrate level 0K comprises transistors 0 tand interconnects 0 i. Transistors 0 t are formed in a semiconductorsubstrate 0, while interconnects 0 i, including substrate metal layers0M1, 0M2, are formed above the substrate 0 but below the lowest memorylevel 16A. The memory levels (e.g. 16A) are coupled to the substrate 0through contact vias (e.g. 1 av).

Each of the memory levels (e.g. 16A) comprises a plurality of upperaddress lines (e.g. 2 a), lower address lines (e.g. 1 a) and memorycells (e.g. 5 aa). The memory cells could comprise diodes, transistorsor other devices. Among all types of memory cells, the diode-basedmemory cells are of particular interest between they have the smallestsize of ˜4F², where F is the minimum feature size. Since they aregenerally formed at the cross points between the upper and lower addresslines, the diode-based memory cells can form a cross-point array.Hereinafter, diode is broadly interpreted as any two-terminal devicewhose resistance at the read voltage is substantially lower than whenthe applied voltage has a magnitude smaller than or polarity opposite tothat of the read voltage. In one exemplary embodiment, diode is asemiconductor diode, e.g. p-i-n silicon diode. In another exemplaryembodiment, diode is a metal-oxide diode, e.g. titanium-oxide diode,nickel-oxide diode.

In this figure, the memory levels 16A, 16B form at least a 3D-M array16, while the substrate level 0K comprises the peripheral circuits forthe 3D-M array 16. A first portion of the peripheral circuits arelocated underneath the 3D-M array 16 and therefore, referred to asunder-array peripheral circuit. A second portion of the peripheralcircuits are located outside the 3D-M array 16 and therefore, referredto as outside-array peripheral circuits 18. Because the space 17 abovethe outside-array peripheral circuits 18 does not contain any memorycells, it is wasted.

U.S. Pat. No. 7,383,476 issued to Crowley et al. on Jun. 3, 2008discloses an integrated 3D-M die 20. The integrated 3D-M die 20comprises all necessary peripheral-circuit components in such a way thatits voltage supply 23 is directly provided by a user (e.g. a hostdevice) and its input/output 27 can be directly used by the user.

As illustrated in FIG. 1B, the integrated 3D-M die 20 comprises a3D-array region 22 and a peripheral-circuit region 28. The 3D-arrayregion 22 comprises a plurality of 3D-M arrays (e.g. 22 aa, 22 ay) andtheir decoders (e.g. 24, 24G). These decoders include local decoders 24and global decoders 24G. The local decoder 24 decodes address for asingle 3D-M array, while the global decoder 24G decodes address to each3D-M array.

The peripheral-circuit region 28 comprises read/write-voltage generator(V_(R)/V_(W)-generator) 21 and address/data translator (A/D-translator)29. The V_(R)/V_(W)-generator 21 provides read voltage V_(R) and/orwrite (programming) voltage V_(W) to the 3D-M array(s). TheA/D-translator 29 converts address and data from a logical space to aphysical space and vice versa. Here, the logical space is the spaceviewed from the perspective of a user (e.g. a host device) of the 3D-M,while the physical space is the space viewed from the perspective of the3D-M.

The V_(R)/V_(W)-generator 21 includes a band gap reference generator(precision reference generator) 21B, a V_(R) generator 21R and a chargepump 21W. Among them, the V_(R) generator 21R generates the read voltageV_(R), while the charge pump 21W generates the write voltage V_(W)(referring to U.S. Pat. No. 6,486,728, “Multi-Stage Charge Pump”, issuedto Kleveland on Nov. 26, 2002). The prior-art integrated 3D-M die 20generates both read voltage and write voltage internally.

The A/D-translator 29 includes address translator and data translator.The address translator converts a logical address to a physical addressand vice versa, while the data translator converts a logical data to aphysical data and vice versa. Hereinafter, the logical address is theaddress at which data appears to reside from the perspective of the userand the physical address is the memory address that is represented onthe address bus of the memory. Similarly, the logical data is the datatransmitted from or received by the user and the physical data is thedata that are physically stored in the memory cells. Note that thelogical address/data are represented on the input/output 27 of the 3D-Mdie 20, while the physical address/data are represented on the internalbus 25 directly coupled to the 3D-M array(s) 22.

The A/D-translator 29 of FIG. 1B includes an error checking & correction(ECC) circuit 29E, a page register/fault memory 29P and a smart writecontroller 29W. The ECC circuit 29E detects and corrects errors whileperforming ECC-decoding after data are read out from the 3D-M array(s)(referring to U.S. Pat. No. 6,591,394, “Three-Dimensional Memory Arrayand Method for Storing Data Bits and ECC Bits Therein” issued to Lee etal. on Jul. 8, 2003). The page register/fault memory 29P serves as anintermediate storage device with respect to the user and the 3D-Marray(s) (referring to U.S. Pat. No. 8,223,525, “Page Register OutsideArray and Sense Amplifier Interface”, issued to Balakrishnan et al. onJul. 17, 2012). It performs ECC-encoding before data are written to the3D-M array(s). The smart write controller 29W collects detected errorsduring programming and activates the self-repair mechanism which willreprogram the data in a redundant row (referring to U.S. Pat. No.7,219,271, “Memory Device and Method for Redundancy/Self-Repair”, issuedto Kleveland et al. on May 15, 2007). The prior-art integrated 3D-M die20 performs both address translation and data translation internally.

The V_(R)/V_(W)-generator 21 and A/D-translator 29 are outside-arrayperipheral-circuit components 18. Because they occupy a large area onthe 3D-M die 20, the prior-art integrated 3D-M die 20 has a low arrayefficiency. The array efficiency is defined as the ratio between thetotal memory area (i.e. the chip area used for memory) and the totalchip area. In 3D-M, the total memory area (AM) is the chip area directlyunderneath user-addressable bits (i.e. not counting bits a user cannotaccess) and can be expressed as A_(M)=A_(c)*C_(L)=(4F²)*C_(3D-M)/N,where C_(L) is the storage capacity per memory level, A_(c) is the areaof a single memory cell, C_(3D-M) is the total storage capacity of the3D-M, F is the address-line pitch, and N is the total number of memorylevels in the 3D-M. In the following paragraphs, two 3D-M dies areexamined for their array efficiencies.

As a first example, a 3-D one-time-programmable memory (3D-OTP) isdisclosed in Crowley et al. “512 Mb PROM with 8 Layers of Antifuse/DiodeCells” (referring to 2003 International Solid-State Circuits Conference,FIG. 16.4.5). This 3D-OTP die has a storage capacity of 512 Mb andcomprises eight memory levels manufactured at 0.25 um node. The totalmemory area is 4*(0.25 um)²*512 Mb/8=16 mm². With a total chip area of48.3 mm², the array efficiency of the 3D-OTP die is ˜33%.

As a second example, a 3-D resistive random-access memory (3D-ReRAM) isdisclosed in Liu et al. “A 130.7 mm² 2-Layer 32 Gb ReRAM Memory Devicein 24 nm Technology” (referring to 2013 International Solid-StateCircuits Conference, FIG. 12.1.7). This 3D-ReRAM die has a storagecapacity of 32 Gb and comprises two memory levels manufactured at 24 nmnode. The total memory area is 4*(24 nm)²*32 Gb/2=36.8 mm². With a totalchip area of 130.7 mm², the array efficiency of the 3D-ReRAM die is˜28%.

In the prior-art integrated 3D-M, its 3D-M arrays are integrated withall of its peripheral-circuit components. The peripheral-circuitcomponents of the 3D-M include V_(R)/V_(W)-generator and A/D-translator.The integrated 3D-M is thought to be advantageous based on theprevailing belief that integration will lower the overall cost of anintegrated circuit. However, this belief is no longer true for 3D-M.Because the 3D-M arrays use a complex back-end process while theirperipheral circuits use a relatively simple back-end process,integrating the 3D-M arrays with their peripheral-circuit componentswill force the peripheral-circuit components to use the expensivemanufacturing process for the 3D-M arrays. As a result, integration doesnot lower the overall cost of the 3D-M, but actually increases it. Tomake things worse, because they can only use the same number of thesubstrate metal layers (as few as two) as the 3D-M arrays, theperipheral-circuit components are difficult to design and occupy a largechip area. Finally, because the 3D-M cells generally requirehigh-temperature processing, the peripheral-circuit components need touse high-temperature interconnect materials, e.g. tungsten (W). Thisdegrades the 3D-M performance.

Objects and Advantages

It is a principle object of the present invention to provide athree-dimensional memory (3D-M) with a lower overall cost.

It is a further object of the present invention to provide a 3D-M withan improved performance.

In accordance with these and other objects of the present invention, adiscrete 3D-M is disclosed. The design philosophy behind the discrete3D-M is to minimize manipulation on power supply, data and addressinside a 3D-M die.

SUMMARY OF THE INVENTION

The present invention discloses a discrete three-dimensional memory(3D-M). It comprises at least a 3D-array die and at least aperipheral-circuit die. The 3D-array die comprises a plurality of 3D-Marrays, each of which is formed in a 3-D space and comprises a pluralityof vertically stacked memory cells. The peripheral-circuit die is formedon a 2-D plane and comprises a single functional level. It comprises atleast one of the peripheral-circuit components. The peripheral-circuitcomponents of the 3D-M include read/write-voltage generator(V_(R)/V_(W)-generator) and address/data translator (A/D-translator).

Different from the integrated 3D-M where all peripheral-circuitcomponents are located on the 3D-M die, at least one peripheral-circuitcomponent of the discrete 3D-M is located on the peripheral-circuit die.Because the 3D-array die comprises fewer peripheral-circuitcomponent(s), its array efficiency could be larger than 40%. By movingall peripheral-circuit components to the peripheral-circuit die, thearray efficiency of the 3D-array die could reach ˜60%.

Because it is manufactured using an independent process with lesscomplex back-end, the wafer cost of the peripheral-circuit die is muchless than the 3D-array die. As a result, the discrete 3D-M is lessexpensive than the integrated 3D-M for a given storage capacity. Inaddition, by using discrete 3D-M, the size of the peripheral-circuitcomponents can be reduced. Being a separate die, the peripheral-circuitdie can comprise more substrate metal layers (e.g. four vs. two) andtherefore, the peripheral-circuit components on the peripheral-circuitdie are easier to design and occupy less chip area. Furthermore, becausethe peripheral-circuit die does not require high-temperature processing,its interconnects may use high-speed interconnect materials, e.g. copper(Cu). This can improve the 3D-M performance.

The present invention discloses another preferred discrete 3D-Mcomprising at least a separate peripheral-circuit die and a plurality ofseparate 3D-array dies. The peripheral-circuit die performsV_(R)/V_(W)-generation and/or A/D-translation for multiple 3D-arraydies. Sharing the peripheral-circuit die among multiple 3D-array diesresults in further cost reduction. This preferred discrete 3D-M can beused for high-capacity memory card and solid-state storage.

The present invention discloses yet another preferred discrete 3D-Mcomprising a separate V_(R)/V_(W)-generator die and a separateA/D-translator die. The V_(R)/V_(W)-generator is an analog-intensivecircuit, while the A/D-translator is a digital-intensive circuit.Because they are located on separate dies, these circuits can beoptimized independently: the V_(R)/V_(W)-generator die is optimized foranalog performance, while the A/D-translator die is optimized fordigital performance.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a cross-sectional view of a prior-art three-dimensionalmemory (3D-M); FIG. 1B is a system architecture of a prior-artintegrated 3D-M die;

FIG. 2A illustrates a first preferred discrete 3D-M with a separateread/write-voltage generator (V_(R)/V_(W)-generator) die; FIG. 2Billustrates a second preferred discrete 3D-M with a separateV_(R)/V_(W)-generator die and a separate address/data translator(A/D-translator) die; FIG. 2C illustrates a third preferred discrete3D-M that supports multiple 3D-array dies;

FIG. 3A is a cross-sectional view of a preferred 3D-array die; FIG. 3Bis a cross-sectional view of a preferred peripheral-circuit die;

FIGS. 4A-4B disclose a first preferred partitioning scheme;

FIGS. 5A-5C disclose a second preferred partitioning scheme;

FIGS. 6A-6C disclose a third preferred partitioning scheme;

FIG. 7A is a block diagram of a preferred V_(R)/V_(W)-generator die formultiple 3D-array dies; FIG. 7B is a block diagram of a preferredA/D-translator die for multiple 3D-array dies;

FIGS. 8A-8B are cross-sectional views of two preferred discrete 3D-Mpackages; FIG. 8C is a cross-sectional view of a preferred discrete 3D-Mmodule;

FIGS. 9A-9C are block diagrams of three preferredV_(R)/V_(W)-generators;

FIG. 10A is a block diagram of a preferred address translator; FIG. 10Bis a block diagram of a preferred data translator.

It should be noted that all the drawings are schematic and not drawn toscale. Relative dimensions and proportions of parts of the devicestructures in the figures have been shown exaggerated or reduced in sizefor the sake of clarity and convenience in the drawings. The samereference symbols are generally used to refer to corresponding orsimilar features in the different embodiments.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Those of ordinary skills in the art will realize that the followingdescription of the present invention is illustrative only and is notintended to be in any way limiting. Other embodiments of the inventionwill readily suggest themselves to such skilled persons from anexamination of the within disclosure.

In the present invention, the symbol “/” means a relationship of “and”or “or”. For example, the read/write-voltage generator(V_(R)/V_(W)-generator) could generate either only the read voltage, oronly the write voltage, or both the read voltage and the write voltage;the address/data translator (A/D-translator) could translate either onlyaddress, or only data, or both address and data.

Referring now to FIGS. 2A-2C, three preferred discrete three-dimensionalmemory (3D-M) 50 are disclosed. The discrete 3D-M 50 includes a physicalinterface 54 according to a standard for connecting to a variety ofhosts. Physical interface 54 includes individual contacts 52 a, 52 b, 54a-54 d that connect with corresponding contacts in a host receptacle.The power-supply contact 52 a is provided to connect to a power-supplycontact in the host receptacle. The voltage supplied by the host topower-supply contact 52 a is referred to as voltage supply V_(DD). Theground contact 52 b provides a ground connection at a voltage V_(SS).The contacts 54 a-54 d provide signal connections between the host andthe discrete 3D-M 50. The signals represented on the contacts 54 a-54 dinclude address and data, among others. Because they are directlyto/from the host, the address and data represented on the contacts 54a-54 d are logical address and logical data.

The discrete 3D-M 50 comprises at least a 3D-array die 30 and at least aperipheral-circuit die 40. The 3D-array die 30 comprises a plurality of3D-M arrays, while the peripheral-circuit die 40 comprises at least oneof the peripheral-circuit components. The peripheral-circuit componentsof the 3D-M include read/write-voltage generator (V_(R)/V_(W)-generator)and address/data translator (A/D-translator). More details of the3D-array die 30 are disclosed in FIGS. 3A, 4A, 5A, 6A, while moredetails of the peripheral-circuit die 40, 40* are disclosed in FIGS. 3B,4B, 5B-5C, 6B-6C, and 7A-7B.

The preferred discrete 3D-M 50 in FIG. 2A is in the form of a memorycard. Its peripheral-circuit die 40 is a V_(R)/V_(W)-generator die. TheV_(R)/V_(W)-generator die 40 receives a voltage supply V_(DD) from thepower-supply contact 52 a and provides the 3D-array die 30 with at leasta read/write voltage through a power bus 56. The read/write voltageincludes at least a read voltage and/or a write voltage other than thevoltage supply V_(DD). In other words, it could be either at least aread voltage V_(R), or at least a write voltage V_(W), or both readvoltage V_(R) and write voltage V_(W), and the values of these readvoltages and write voltages are different from the voltage supplyV_(DD). In this preferred embodiment, the read/write voltage includesone read voltage V_(R) and two write voltages V_(W1), V_(W2).Alternatively, it could include more than one read voltage or more thantwo write voltages. More details on V_(R)/V_(W)-generator are disclosedin FIGS. 9A-9C.

The preferred discrete 3D-M 50 in FIG. 2B is also in the form of amemory card. It comprises two separate peripheral-circuit dies, i.e. aV_(R)/V_(W)-generator die 40 and an A/D-translator die 40*. TheV_(R)/V_(W)-generator die 40 is similar to that in FIG. 2A. TheA/D-translator die 40* converts logical address/data represented on thecontacts 54 a-54 d to physical address/data represented on an internalbus 58 and vice versa. More details on A/D-translator are disclosed inFIGS. 10A-10B.

The preferred discrete 3D-M 50 in FIG. 2C is a solid-state drive. Itcomprises a plurality of 3D-array dies 30 a, 30 b . . . 30 w. These3D-array dies form two channels: Channel A and Channel B. The internalbus 58A on Channel A provides physical address/data to the 3D-array dies30 a, 30 b . . . 30 i, while the internal bus 58B on Channel B providesphysical address/data to the 3D-array dies 30 r, 30 s . . . 30 w. Thepower bus 56 provides read/write-voltages to all 3D-array dies 30 a, 30b . . . 30 w. Although two channels are used in this example, it shouldbe apparent to those skilled in the art that more than two channels maybe used in a 3D-M solid-state drive.

Referring now to FIGS. 3A-3B, cross-sectional views of preferred3D-array die 30 and peripheral-circuit die 40 are illustrated. Asillustrated in FIG. 3A, the preferred 3D-array die 30 is formed in a 3-Dspace and comprises multiple functional levels, i.e. substrate level 0Kand memory levels 16A, 16B. The substrate level 0K comprises transistors0 t and interconnects 0 iA. Transistors 0 t are formed in a 3D-arraysubstrate 0A. Interconnects 0 iA include two substrate metal layers 0M1,0M2. To accommodate the high-temperature process for the memory cells(e.g. 5 aa), the substrate metal layers 0M1, 0M2 preferably comprisehigh-temperature interconnect materials, e.g. tungsten (W). The memorylevels 16A, 16B and their substrate metal layers are similar to those ofthe 3D-M 20 of FIG. 1A.

In FIG. 3B, the preferred peripheral-circuit die 40 is formed on a 2-Dplane and comprises a single functional level, i.e. the substrate level0K′. The substrate level 0K′ comprises transistors 0 t and interconnects0 iB. Transistors are formed on a peripheral-circuit substrate 0B.Interconnects 0 iB include four substrate metal layers 0M1′-0M4′.Because the 3D-array die 30 and the peripheral-circuit die 40 are twoseparate dies, the peripheral-circuit die 40 can be manufactured usingan independent and less expensive process, not the expensive process forthe 3D-array die 30. As a result, the wafer cost of theperipheral-circuit die 40 is significantly less than that of the3D-array die 30.

Being a separate die, the peripheral-circuit die 40 can comprise moresubstrate metal layers (four vs. two) than the 3D-array die 30.Accordingly, the peripheral-circuit components on the peripheral-circuitdie 40 are easier to design and occupy less chip area than those on theintegrated 3D-M die 20. Furthermore, because the peripheral-circuit die40 does not require high-temperature processing, its interconnects 0 iBmay use high-speed interconnect materials, e.g. copper (Cu). This canimprove the performance of the peripheral-circuit die 40, as well as theperformance of the 3D-M.

The discrete 3D-M becomes more advantageous when it comprises a separateV_(R)/V_(W)-generator die 40 and a separate A/D-translator die 40*(FIGS. 2B-2C). The V_(R)/V_(W)-generator is an analog-intensive circuit,while the A/D-translator is a digital-intensive circuit. Because theyare located on separate dies, different manufacturing process may beused to optimize analog or digital performance separately: theV_(R)/V_(W)-generator die 40 can be optimized for analog performance,while the A/D-translator die 40* can be optimized for digitalperformance.

Different from the integrated 3D-M 20 where all peripheral-circuitcomponents are located on the 3D-M die 20, at least oneperipheral-circuit component of the discrete 3D-M 50 is located on theperipheral-circuit die 40. In other words, the peripheral-circuitcomponents are partitioned between the 3D-array die 30 and theperipheral-circuit die 40. Several preferred partitioning schemes aredisclosed in FIGS. 4A-7B.

FIGS. 4A-4B disclose a first preferred partitioning scheme. The discrete3D-M 50 comprises a 3D-array die 30 and a peripheral-circuit die 40. InFIG. 4A, the 3D-array die 30 comprises a plurality of 3D-M arrays (e.g.22 aa, 22 ay) and decoders. It also comprises address translator 43 anddata translator 45. However, it does not comprise at least oneperipheral-circuit component, which is V_(R)/V_(W)-generator 41 in thisexample. In FIG. 4B, the peripheral-circuit die 40 comprises theperipheral-circuit component(s) that is (are) absent in the 3D-array die30 of FIG. 4A, i.e. the V_(R)/V_(W)-generator 41. Because at least oneperipheral-circuit component is absent in the 3D-array die 30, the arrayefficiency of the 3D-array die 30 of FIG. 4A could be larger than 40%.

FIGS. 5A-5C disclose a second preferred partitioning scheme. Thediscrete 3D-M 50 comprises a 3D-array die 30 and two separateperipheral-circuit dies 40, 40*. In FIG. 5A, the 3D-array die 30comprises only the 3D-M arrays (e.g. 22 aa, 22 ay) and their decoders.In FIG. 5B, the peripheral-circuit die 40* is an A/D-translator die,which comprises the address translator 43 and the data translator 45. InFIG. 5C, the peripheral-circuit die 40 is a V_(R)/V_(W)-generator die,which comprises the V_(R)/V_(W)-generator 41. Because allperipheral-circuit components are absent in the 3D-array die 30, thearray efficiency of the 3D-array die 30 of FIG. 5A could reach ˜60%.

Because it is manufactured using an independent process with lesscomplex back-end, the wafer cost of the peripheral-circuit die 40 ismuch less than the 3D-array die 30. As a simple estimate, suppose thewafer cost of the peripheral-circuit die 40 is about half of the3D-array die 30 and the array efficiency increases from 30% to 60%, theoverall cost of the discrete 3D-M is ˜75% of the integrated 3D-M. Thatis a decrease of ˜25% for a given storage capacity.

FIGS. 6A-6C disclose a third partitioning scheme. It is similar to thosein FIGS. 5A-5C except that the 3D-array die 30 (FIG. 6A) furthercomprises a first serializer-deserializer (SerDes) 47. It convertsparallel digital signals (e.g. address/data/command/status) inside the3D-array die 30 to serial digital signals outside the 3D-array die 30and vice versa. The A/D-translator die 40* further comprise a secondserializer-deserializer (SerDes) 47*. It converts parallel digitalsignals (e.g. address/data/command/status) inside the peripheral-circuitdie 40 to serial digital signals outside the peripheral-circuit die 40and vice versa. By serializing digital signals, the number of bond wires(or, solder bumps) can be reduced between the 3D-array die 30 and theA/D-translator die 40*. This helps to reduce the bonding cost.

Referring now to FIGS. 7A-7B, the peripheral-circuit dies that supportsmultiple 3D-array dies are illustrated. The peripheral-circuit die 40 ofFIG. 7A is a V_(R)/V_(W)-generator die. It comprises a plurality ofV_(R)/V_(W)-generators 41 a, 41 b . . . 41 w. Each V_(R)/V_(W)-generator(e.g. 41 a) provides read/write voltages to a corresponding 3D-array die(e.g. 30 a of FIG. 2C). Similarly, the preferred peripheral-circuit die40* of FIG. 7B is an A/D-translator die. It comprises a plurality ofaddress translators 43 a, 43 b . . . 43 w and a plurality of datatranslators 45 a, 45 b . . . 45 w. Each address translator (e.g. 43 a)and each data translator (e.g. 45 a) translate address/data for acorresponding 3D-array die (e.g. 30 a of FIG. 2C).

Referring now to FIG. 8A-8C, several preferred discrete 3D-M packages(or, module) 50 are disclosed. The 3D-M packages in FIGS. 8A-8B aremulti-chip package (MCP). The preferred discrete 3D-M package 50 of FIG.8A comprises two separate dies: a 3D-array die 30 and aperipheral-circuit die 40. These dies 30, 40 are vertically stacked on apackage substrate 53 and located inside a package housing 51. Bond wires55 provide electrical connection between the dies 30 and 40. Here, bondwire 55 provides a coupling means between the 3D-array die 30 and theperipheral-circuit die 40. Other coupling means include solder bump. Toensure data security, the dies 30, 40 are preferably encapsulated into amolding compound 57. In this preferred embodiment, the 3D-array die 30is vertically stacked above the peripheral-circuit die 40.Alternatively, the 3D-array die 30 can be stacked face-to-face towardsthe peripheral-circuit die 40, or, the 3D-array die 30 can be mountedside-by-side with the peripheral-circuit die 40.

The preferred discrete 3D-M package 50 of FIG. 8B comprises two 3D-arraydies 30 a, 30 b and a peripheral-circuit die 40. These dies 30 a, 30 b,40 are three separate dies. They are located inside a package housing51. The 3D-array die 30 a is vertically stacked on the 3D-array die 30b, and the 3D-array die 30 b is vertically stacked on theperipheral-circuit die 40. Bond wires 55 provide electrical connectionsbetween the dies 30A, 30B, and 40. The circuit block diagram of thispreferred 3D-M package 50 is similar to that of FIG. 2C.

The discrete 3D-M module 50* of FIG. 8C is a multi-chip module (MCM). Itcomprises a module frame 66, which houses two discrete packages, i.e. a3D-array package 62 and a peripheral-circuit package 64. The 3D-arraypackage 62 compromises two 3D-array dies 30 a, 30 b, while theperipheral-circuit package 64 comprises a peripheral-circuit die 40. Themodule frame 66 provides electrical connections between the 3D-arraypackage 62 and the peripheral-circuit package 64 (not drawn in thisfigure). The circuit block diagram of this preferred 3D-M module 50* issimilar to that of FIG. 2C.

Referring now to FIGS. 9A-9C, three preferred V_(R)/V_(W)-generators 41are disclosed. The V_(R)/V_(W)-generator 41 preferably uses a DC-to-DCconverter. It could be a step-up, whose output voltage is higher thanthe input voltage, or a step-down, whose output voltage is lower thanthe input voltage. Examples of step-up include charge pump (FIG. 9A) andboost converter (FIG. 9B), and examples of step-down include low dropout(FIG. 9C) and buck converter.

In FIG. 9A, the V_(R)/V_(W)-generator 41 includes a charge pump 72 toprovide an output voltage V_(out) that is higher than the input voltageV_(in). The V_(R)/V_(W)-generator 41 may include one or more integratedcircuits and also include one or more discrete devices. Charge pump 72may generally be formed having a low profile that fits within thephysical constraints of low-profile memory cards.

In FIG. 9B, the V_(R)/V_(W)-generator 41 is a high frequency boostconverter 74. It may also be used to generate an output voltage V_(out)that is higher than an input voltage V_(in). A boost converter may beformed with a low profile inductor so that the profile of theV_(R)/V_(W)-generator is within the limits for a memory card or asolid-state drive.

In FIG. 9C, the V_(R)/V_(W)-generator 41 includes a low dropout (LDO) 76to provide an output voltage V_(out) that is lower than the inputvoltage V_(in). Generally, an LDO uses one or more (in this case, two)capacitors. Thus, the V_(R)/V_(W)-generator may be comprised of at leastone die and may also include one or more discrete devices.

Referring now to FIGS. 10A-10B, components of an A/D-translator, i.e.address translator 43 and data translator 45, are disclosed. FIG. 10Adiscloses a preferred address translator 43. It converts the logicaladdress 54A it receives from the host to the physical address 58A of a3D-array die. The address translator 43 comprises a processor 92 and amemory 94. The memory 94 stores at least an address mapping table 82, afaulty block table 84 and a wear management table 86. These tables 82,84, 86 are permanently stored in a read-only memory (ROM), which could anon-volatile memory (NVM) such as flash memory. During operation, thesetables 82, 84, 86 are loaded into a random-access memory (RAM) forfaster access. When a single A/D-translator die 40* supports multiple3D-array dies (e.g. 30 a, 30 b . . . 30 w, as shown in FIG. 2C), thememory 94 stores tables 82, 84, 86 for all 3D-array dies supported bythe A/D-translator die 40*. In other words, the memory 94 is shared byall 3D-array dies 30 a, 30 b . . . 30 w.

Among tables 82, 84, 86 stored in the memory 94, the address mappingtable 82 maintains links between the logical address and the physicaladdress; the faulty block table 84 records the addresses of the faultyblocks in the 3D-M array(s); and the wear management table 88 keeps alog of the number of read/write performed to each block. As used herein,the term “block” refers to an allocation unit of memory and can be anysize ranging from a single memory cell to all of the memory cells in a3D-M array.

During read, upon receiving the input logical address 54A, the processor94 looks up the address mapping table 82 and fetches the physicaladdress 58A corresponding to the logical address 54A. During write, uponreceiving the input logical address 54A, the processor 94 looks up theaddress mapping table 82, the faulty block table 84 and the wearmanagement table 88 to choose an unused, good and less-used block towrite the data. While the processor 94 outputs the physical address 58Aof the chosen block, it writes this physical address 58A to the addressmapping table 82.

FIG. 10B discloses a preferred data translator 45. It converts thelogical data it receives from the host to the physical data of a3D-array die, or converts the physical data of a 3D-array die to thelogical data it outputs to the host. The data translator 45 comprises anECC-encoder 96 and an ECC-decoder 98. The ECC-encoder 96 encodes theinput logical data 54D to the physical data 58D, which are to be storedin the 3D-M array. The ECC-decoder 98 decodes the physical data 58Dretrieved from the 3D-M array to the output logical data 54D. Duringthis process, the error bits in the physical data 58D are detected andcorrected. The ECC coding algorithms that are suitable for the 3D-Minclude Reed-Solomon coding, Golay coding, BCH coding, Multi-dimensionalparity coding, Hamming coding and others.

While illustrative embodiments have been shown and described, it wouldbe apparent to those skilled in the art that may more modifications thanthat have been mentioned above are possible without departing from theinventive concepts set forth therein. The invention, therefore, is notto be limited except in the spirit of the appended claims.

What is claimed is:
 1. A discrete three-dimensional memory (3D-M),comprising: a 3D-array die comprising at least a 3D-M array including aplurality of vertically stacked memory cells; a peripheral-circuit diecomprising at least a portion of an address/data translator forconverting at least an address and/or data between logical and physicalspaces for said 3D-array die, wherein said portion of said address/datatranslator is absent from said 3D-array die; wherein saidperipheral-circuit die comprises fewer back-end layers than said3D-array die; and, said 3D-array die and said peripheral-circuit die areseparate dice.
 2. The memory according to claim 1, wherein saidperipheral-circuit die comprises more substrate interconnect layers thansaid 3D-array die.
 3. The memory according to claim 1, wherein saidperipheral-circuit die comprises different interconnect materials thansaid 3D-array die.
 4. The memory according to claim 1, wherein said 3D-Mcomprises a three-dimensional read-only memory (3D-ROM) or athree-dimensional random-access memory (3D-RAM).
 5. The memory accordingto claim 1, wherein said 3D-M comprises a three-dimensionalmask-programmed read-only memory (3D-MPROM) or a three-dimensionalelectrically-programmable read-only memory (3D-EPROM).
 6. The memoryaccording to claim 1, wherein said address/data translator is an addresstranslator comprising at least one of an address mapping table, a faultyblock table and a wear management table.
 7. The memory according toclaim 1, wherein said address/data translator is a data translatorcomprising at least one of an ECC-encoder and an ECC-decoder.
 8. Thememory according to claim 1, where said 3D-array die comprises a firstserializer-deserializer and said peripheral-circuit die comprises asecond serializer-deserializer.
 9. The memory according to claim 1,further comprising another 3D-array die, wherein said peripheral-circuitdie further comprises at least another portion of another address/datatranslator for said another 3D-array die, and said another portion ofsaid another address/data translator is absent from said another3D-array die.
 10. The memory according to claim 1, wherein said 3D-arrayand peripheral-circuit dice are located in a memory package, a memorymodule, a memory card or a solid-state drive.
 11. A discretethree-dimensional memory (3D-M), comprising: a 3D-array die comprisingat least a 3D-M array including a plurality of vertically stacked memorycells; a peripheral-circuit die comprising at least a portion of anaddress/data translator for converting at least an address and/or databetween logical and physical spaces for said 3D-array die, wherein saidportion of said address/data translator is absent from said 3D-arraydie; wherein said peripheral-circuit die comprises differentinterconnect materials than said 3D-array die; and, said 3D-array dieand said peripheral-circuit die are separate dice.
 12. The memoryaccording to claim 11, wherein said 3D-array die compriseshigh-temperature interconnect materials.
 13. The memory according toclaim 11, wherein said peripheral-circuit die comprises high-speedinterconnect materials.
 14. The memory according to claim 11, whereinsaid peripheral-circuit die comprises fewer back-end layers than said3D-array die.
 15. The memory according to claim 11, wherein saidperipheral-circuit die comprises more substrate interconnect layers thansaid 3D-array die.
 16. The memory according to claim 11, wherein said3D-M comprises a three-dimensional read-only memory (3D-ROM) or athree-dimensional random-access memory (3D-RAM).
 17. The memoryaccording to claim 11, wherein said address/data translator is anaddress translator comprising at least one of an address mapping table,a faulty block table and a wear management table.
 18. The memoryaccording to claim 11, wherein said address/data translator is a datatranslator comprising at least one of an ECC-encoder and an ECC-decoder.19. The memory according to claim 11, further comprising another3D-array die, wherein said peripheral-circuit die further comprises atleast another portion of another address/data translator for saidanother 3D-array die, and said another portion of said anotheraddress/data translator is absent from said another 3D-array die. 20.The memory according to claim 11, wherein said 3D-array andperipheral-circuit dice are located in a memory package, a memorymodule, a memory card or a solid-state drive.